Future of chip making to lean heavily on AI for spotting defects, says Applied Materials

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For the first time, a machine learning program will tell a scanning electron microscope where to look closer for defects in a silicon wafer
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This entry was posted on Tuesday, June 1st, 2021 at 12:02 am and is filed under Latest topics for ZDNet in Hardware. You can follow any responses to this entry through the RSS 2.0 feed. You can .
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